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In 2025, Changzhou Hefeng Packaging Materials Co., Ltd. applied for a patent for a blown film guide device for polyimide PI materials

  • Release time: 2025-07-02

In 2025, Changzhou Hefeng Packaging Materials Co., Ltd. applied for a patent for a guiding device for polyimide (PI) material blown film process. This technology aims to improve the tension control and guidance accuracy during the blown film forming process of PI film, ensuring the dimensional stability and quality consistency of the product.

Through the research and development of this patent, the company has further improved its technical reserves for high-performance material blown film equipment, supporting the industrial development of functional film materials such as polyimide.

url: https://www.hhfpack.com/en/news/63.html

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